Method of making a drop-in heat sink

Metal working – Method of mechanical manufacture – Electrical device making

Patent

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Details

29855, 2989003, 257796, 26427215, 26427217, 361723, H01R 4300

Patent

active

054449090

ABSTRACT:
A heat sink incorporated into an electronic package. The package contains an integrated circuit enclosed by a dielectric housing. Coupled to the circuit is a lead frame which has a plurality of leads that extend from the outer edges of the housing. The heat sink has a bottom surface pressed against the lead frame and an opposite top surface that is exposed to the ambient. The heat sink also has a pair of oblique steps which engage the housing and insure that the sink does not become detached from the package.

REFERENCES:
patent: 3930114 (1975-12-01), Hodge
patent: 4701999 (1987-10-01), Palmer
patent: 5020207 (1991-06-01), Minoda et al.
patent: 5041902 (1991-08-01), McShane
patent: 5091341 (1992-02-01), Asada et al.

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