Electronics package that has a substrate with an array of hollow

Details Electronics package that has a substrate with an array of hollow Electronics package that has a substrate with an array of hollow

1998-05-29

1999-08-10

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361774, 361760, 361772, 361783, 361779, 174260265-, 22818021, 22818022, 257692, 257698, 257774, 257723, 257724, 257737, 257738, H05K 702

Patent

active

059368489

ABSTRACT:
An electronics package includes a substrate, a via and a solder ball. The substrate has first and second opposed surfaces. The via is located within the substrate and terminates at the first surface. The via defines an opening having first and second opposed walls. The solder ball is at least partially located over the opening. The solder ball has first and second opposed sides, the first side being adjacent the first wall and the second side being adjacent the second wall. The first side is nearer to the first wall than the second side is to the second wall.

REFERENCES:
patent: 5239198 (1993-08-01), Lin et al.
patent: 5504277 (1996-04-01), Danner
patent: 5591941 (1997-01-01), Accocella et al.
patent: 5640047 (1997-06-01), Nakashima
patent: 5764485 (1998-06-01), Lebaschi
patent: 5796163 (1998-08-01), Glenn et al.

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