Ball grid array integrated circuit package

Details Ball grid array integrated circuit package Ball grid array integrated circuit package

1997-12-02

2000-10-17

Picardat, Kevin M.

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438613, 257773, 361772, H01L 2144, H01L 2349

Patent

active

061331341

ABSTRACT:
A ball grid array integrated circuit package which has a plurality of elliptical shaped solder pads located on a substrate of the package. Routing traces are connected to the apexes of the elliptical shaped solder pads. Connecting a routing trace to the apex of an elliptical shaped solder pad reduces the stress points on the trace/pad interface. Vias may be coupled to the solder pads and the routing traces. The vias are located at the apexes of the elliptical shaped solder pads to reduce the stress points of the substrate.

REFERENCES:
patent: 5216278 (1993-06-01), Lin et al.
patent: 5706178 (1998-01-01), Barrow
patent: 5759910 (1998-06-01), Mangold et al.
patent: 5875102 (1999-02-01), Barrow

Affiliated with

Also associated with

Rating

Ball grid array integrated circuit package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Ball grid array integrated circuit package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ball grid array integrated circuit package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-468255