4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Integrated circuit structure with electrically isolated...
  6. Passive components in ics

Bang Won Oh

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active

Chip package assembly having chip package mounted on printed...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

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Chip type thin film capacitor, and manufacturing method...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate

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Light emitting diode and method for manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With reflector – opaque mask – or optical element integral...
Reexamination Certificate

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Method for separating sapphire wafer into chips

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Method for separating sapphire wafer into chips using...

Semiconductor device manufacturing: process – Semiconductor substrate dicing – Having specified scribe region structure
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2021445

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