Method for separating sapphire wafer into chips

Details Method for separating sapphire wafer into chips Method for separating sapphire wafer into chips

2006-07-11

2006-07-11

Chambliss, Alonzo (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S462000, C430S313000, C430S323000

Reexamination Certificate

active

07074652

ABSTRACT:
Disclosed is a method for efficiently separating a sapphire wafer serving as a substrate, on which semiconductor elements are formed, into unit chips by scribing the sapphire wafer, after grinding and lapping a rear surface of the sapphire wafer and then sand-blasting the sapphire wafer. The method includes the steps of: (a) grinding a rear surface of the sapphire wafer so that the sapphire wafer has a designated thickness; (b) lapping the rear surface of the ground sapphire wafer so that the sapphire wafer has a designated thickness; (c) polishing the rear surface of the lapped sapphire wafer so that the sapphire wafer has a designated thickness; (d) sand-blasting the rear surface of the polished sapphire wafer by uniformly blasting particles at a designated pressure during a designated time onto the rear surface of the polished sapphire wafer; and (e) scribing the rear surface of the sand-blast ground sapphire wafer.

REFERENCES:
patent: 5759087 (1998-06-01), Masumura et al.
patent: 6465158 (2002-10-01), Sekiya
patent: 6593170 (2003-07-01), Tateiwa et al.
patent: 2003/0008510 (2003-01-01), Grigg et al.
patent: 10166259 (1998-06-01), None
patent: 2000-331965 (2000-11-01), None
patent: 1999-001788 (1999-01-01), None

Affiliated with

Also associated with

Rating

Method for separating sapphire wafer into chips does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for separating sapphire wafer into chips, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for separating sapphire wafer into chips will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3603142