4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Ball or nail head type contact, lead, or bond

Atsuyuki Fukano

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Magnetic alignment system for bumps on an integrated circuit dev

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Patent

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Magnetic random access memory

Static information storage and retrieval – Read/write circuit – Having fuse element
Reexamination Certificate

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Manufacturing metal dip solder bumps for semiconductor devices

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Spherical semiconductor device and method for fabricating...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Spherical semiconductor device and method for fabricating...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1395919

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