Magnetic alignment system for bumps on an integrated circuit dev

Details Magnetic alignment system for bumps on an integrated circuit dev Magnetic alignment system for bumps on an integrated circuit dev

1999-03-15

1999-11-16

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Ball or nail head type contact, lead, or bond

257781, H01L 2348, H01L 2352, H01L 2940

Patent

active

059863480

ABSTRACT:
A unique integrated circuit device and method for using same is disclosed. The integrated circuit includes a plurality of bonding pads. Coupled to each bonding pads is a ferromagnetic material and an external connector, such as a solder bump. The ferromagnetic material is isolated to an area associated with each bonding pad. When the ferromagnetic material is magnetized, it is capable of aligning the solder bump to a connection point of another device, as long as the connection point is magnetically attracted. The other device may be a second integrated circuit device or a circuit board. As a result, the bonding pad aligns with and connects to the connection point.

REFERENCES:
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patent: 4983804 (1991-01-01), Chan et al.
patent: 5164328 (1992-11-01), Dunn et al.
patent: 5208186 (1993-05-01), Mathew
patent: 5428249 (1995-06-01), Sawayama et al.
patent: 5495378 (1996-02-01), Bonyhard et al.
"Ball-Grid Array: An Ideal Package Option," published in News & Views Q1 1996, Altera Corporation, San Jose, CA.

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