4. Conveyors: power-driven
  5. Conveyor for changing attitude of item relative to conveyed...
  6. For changing both the elevation and the posture of...

Ashok S. Prabhu

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Die attach region for use in a micro-array integrated...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Method of fabricating a micro-array integrated circuit package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Multi-station rotary die handling device

Conveyors: power-driven – Conveyor for changing attitude of item relative to conveyed... – For changing both the elevation and the posture of...
Reexamination Certificate

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Solder pad configuration for use in a micro-array integrated...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Spacer with passive components for use in multi-chip modules

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2473460

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