Method of fabricating a micro-array integrated circuit package

Details Method of fabricating a micro-array integrated circuit package Method of fabricating a micro-array integrated circuit package

2007-03-06

2007-03-06

Zarneke, David A. (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S111000, C257SE21510, C257SE21513

Reexamination Certificate

active

10871188

ABSTRACT:
A method of fabricating a micro-array IC package is recited. A wafer has a B-stageable adhesive applied, and the wafer is diced. The individual dice are applied to a lead-frame via their adhesive, and wirebonded to associated leads. The lead-frame is then encapsulated, and solder connectors are applied. The lead-frame is then singulated to produce a plurality of lead-frame based micro-array packages. The process thus allows lead-frame based manufacturing methods to be employed in the production of BGA-type packages, allowing such packages to be produced faster and more efficiently.

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