4. Metal working
  5. Method of mechanical manufacture
  6. Heat exchanger or boiler making

Ashay A. Dani

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Gel thermal interface materials comprising fillers having...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Gel thermal interface materials comprising fillers having...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Heat dissipating device with preselected designed interface...

Metal working – Method of mechanical manufacture – Heat exchanger or boiler making
Reexamination Certificate

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Multi-layer polymer-solder hybrid thermal interface material...

Metal fusion bonding – Solder form
Reexamination Certificate

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Polymer solder hybrid interface material with improved...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2310222

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