Gel thermal interface materials comprising fillers having...

Details Gel thermal interface materials comprising fillers having... Gel thermal interface materials comprising fillers having...

2005-12-13

2005-12-13

Clark, Jasmine (Department: 2815)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S108000, C438S122000, C438S584000, C438S610000, C438S424000

Reexamination Certificate

active

06974723

ABSTRACT:
A composition including an amount of at least one vinyl terminated polymer; an amount of at least one cross-linker comprising a terminal Si—H unit; an amount of at least one thermally conductive first filler, and at least one thermally conductive second filler, wherein a melting point of the first filler is greater than the melting point of the second filler. An apparatus including a package configured to mate with a printed circuit board; a semiconductor device coupled to the package; a thermal element; and a curable thermal material disposed between the thermal element and the semiconductor device.

REFERENCES:
patent: 6469379 (2002-10-01), Matayabas, Jr.
patent: 6597575 (2003-07-01), Matayabas, Jr.
patent: 6610635 (2003-08-01), Khatri
patent: 6657297 (2003-12-01), Jewram et al.
patent: 6761813 (2004-07-01), Xu
patent: 2002/0000239 (2002-01-01), Sachdev et al.

Affiliated with

Also associated with

Rating

Gel thermal interface materials comprising fillers having... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Gel thermal interface materials comprising fillers having..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Gel thermal interface materials comprising fillers having... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3478293