4. Metal treatment
  5. Barrier layer stock material, p-n type
  6. With recess, void, dislocation, grain boundaries or channel...

Anton Schnegg

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Adhesive mixture suitable for mounting and demounting a...

Compositions: coating or plastic – Coating or plastic compositions – Inorganic settable ingredient containing
Reexamination Certificate

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Cleaning agent and method for cleaning semiconductor wafers

Cleaning and liquid contact with solids – Processes – For metallic – siliceous – or calcareous basework – including...
Patent

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Method of haze-free polishing for semiconductor wafers

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent

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Process and apparatus for etching semiconductor surfaces

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent

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Process for polishing indium phosphide surfaces

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent

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