Cleaning agent and method for cleaning semiconductor wafers

Cleaning and liquid contact with solids – Processes – For metallic – siliceous – or calcareous basework – including...

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134 2, 134 26, 134 28, 134 29, B08B 300

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056955723

ABSTRACT:
A cleaning agent and method are useful for cleaning semiconductor wafers. The aqueous cleaning agent has a pH of 1 to 5, preferably a pH of 1 to 3, and contains at least one surfactant and at least one compound which belongs to a group of compounds comprising succinic acid and its derivatives. To clean the semiconductor wafers, a thin film of cleaning agent is generated on the side faces of the semiconductor wafers, preferably using a mechanical tool.

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