Process for polishing indium phosphide surfaces

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156654, 156662, 252 793, 252 794, H01L 21306, B44C 122, C03C 1500, C03C 2506

Patent

active

044287950

ABSTRACT:
Indium phosphide surfaces can be polished if, during the mechanical polishing operation, which is carried out in a customary manner, a component that yields free chlorine in an aqueous acidic medium, and, at the same time, a component that yields free carbon dioxide are applied to the surface to be polished.

REFERENCES:
patent: 3738882 (1973-06-01), Basi
patent: 3979239 (1976-09-01), Walsh
Japanese Journal of Applied Physics, vol. 19, No. 1, Jan., 1980, pp. 79-85, hemical Etching of INP and GaIn AsP for Fabricating Laser Diodes and Integrated Optical Circuits, Toshio Kambayash et al.

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