Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1983-06-15
1984-01-31
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156654, 156662, 252 793, 252 794, H01L 21306, B44C 122, C03C 1500, C03C 2506
Patent
active
044287950
ABSTRACT:
Indium phosphide surfaces can be polished if, during the mechanical polishing operation, which is carried out in a customary manner, a component that yields free chlorine in an aqueous acidic medium, and, at the same time, a component that yields free carbon dioxide are applied to the surface to be polished.
REFERENCES:
patent: 3738882 (1973-06-01), Basi
patent: 3979239 (1976-09-01), Walsh
Japanese Journal of Applied Physics, vol. 19, No. 1, Jan., 1980, pp. 79-85, hemical Etching of INP and GaIn AsP for Fabricating Laser Diodes and Integrated Optical Circuits, Toshio Kambayash et al.
Kohl Franz
Lener Karl
Schnegg Anton
Collard Allison C.
Galgano Thomas M.
Powell William A.
Wacker-Chemitronic Gesellschaft fur Electronik-Grundstoffe mbH
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