4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Integrated circuit structure with electrically isolated...
  6. Passive components in ics

Anthony K. Stamper

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Air gap under on-chip passive device

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Reexamination Certificate

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Air-gap insulated interconnections

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Total dielectric isolation
Reexamination Certificate

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Apparatus and method for forming a battery in an integrated...

Semiconductor device manufacturing: process – Having integral power source
Reexamination Certificate

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Apparatus and method for forming a battery in an integrated...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – With pn junction isolation
Reexamination Certificate

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Bilayer aluminum last metal for interconnects and wirebond pads

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate

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Profile ID: LFUS-PAI-P-182198

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