4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame
  6. With separate tie bar element or plural tie bars

Anang Subagio

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Die pad for semiconductor packages and methods of making and...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Reexamination Certificate

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Lead frame routed chip pads for semiconductor packages

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Method for making QFN package with power and ground rings

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Method of making thermally enhanced substrate-base package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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RF shielding for a singulated laminate semiconductor device...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Profile ID: LFUS-PAI-P-3099774

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