Method for making QFN package with power and ground rings

Details Method for making QFN package with power and ground rings Method for making QFN package with power and ground rings

2007-03-06

2010-10-19

Huynh, Andy (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S121000, C257S666000, C257S670000, C257S676000, C257SE23037, C257SE23046

Reexamination Certificate

active

07816186

ABSTRACT:
A method to manufacture a package that encases at least one integrated circuit device and the package so manufactured. The method includes the steps of (1) providing a leadframe having a die pad, leads, at least one ring circumscribing the die pad and disposed between the die pad and the leads, a plurality of tie bars projecting outwardly from the at least one ring, and at least one connecting bar electrically interconnecting and mechanically supporting the die pad to the ring; (2) affixing the at least one integrated circuit device to a first side of the die pad and electrically interconnecting the at least one integrated circuit device to the leads and to the at least one ring; (3) encapsulating the at least one integrated circuit device, the first side of the die pad and a first side of the ring in a molding resin while retaining an opposing second side of the ring external to said molding resin; and (4) severing the at least one connecting bar to electrically isolate the die pad from the ring.

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