Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2010-11-24
2011-12-27
Richards, N Drew (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C257SE21602
Reexamination Certificate
active
08084300
ABSTRACT:
A method for manufacturing a semiconductor device package to provide RF shielding. The device is mounted on a laminated substrate having conducting pads on its top surface. A molding compound covers the substrate top surface and encapsulates the devices. The substrate is disposed on a tape; the molding compound and the substrate are cut through, forming package units separated by the saw cut width and exposing a portion of a conducting pad. In an embodiment, the tape is stretched to widen the gap between package units. A conductive shield is applied to cover each package unit and to make electrical contact with the exposed conducting pad portion, thereby connecting to a ground trace beneath the device and providing RF shielding for the device. A single-unit molding process may be used, in which the conducting pad is exposed during and after molding.
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Gultom Lenny Christina
McKerreghan Michael H.
San Antonio Romarico S.
Subagio Anang
Toriaga Allan C.
Richards N Drew
Shook Daniel
Unisem (Mauritius) Holdings Limited
Wiggin and Dana LLP
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