Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
Inventor
active
C4 substrate contact pad which has a layer of Ni-B plating
C4 substrate contact pad which has a layer of NI-B plating
Multi-layer C4 flip-chip substrate
Power-ground plane for a C4 flip-chip substrate
Power-ground plane for a C4 flip-chip substrate
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Profile ID: LFUS-PAI-P-65845