C4 substrate contact pad which has a layer of NI-B plating

Details C4 substrate contact pad which has a layer of NI-B plating C4 substrate contact pad which has a layer of NI-B plating

1997-10-07

1999-04-13

Bowers, Charles

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

257778, H01L 2504

Patent

active

058937250

ABSTRACT:
A flip chip integrated circuit package which has a layer of nickel-boron (Ni--B) on the contact pads of the package substrate and a layer of nickel-phosphorus (Ni--P) on the pins of the substrate. A layer of gold is plated onto the layers of nickel. An integrated circuit with a plurality of solder bumps is placed onto the contact pads of the substrate. The package is heated to reflow the solder bumps, gold and nickel-boron into solder joints that attach the integrated circuit to the substrate. The package is then typically shipped and mounted to a printed circuit board by soldering the pins to the board.

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patent: 5468995 (1995-11-01), Higgins, III
patent: 5583073 (1996-12-01), Lin et al.

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