C4 substrate contact pad which has a layer of NI-B plating

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257778, H01L 2504

Patent

active

058937250

ABSTRACT:
A flip chip integrated circuit package which has a layer of nickel-boron (Ni--B) on the contact pads of the package substrate and a layer of nickel-phosphorus (Ni--P) on the pins of the substrate. A layer of gold is plated onto the layers of nickel. An integrated circuit with a plurality of solder bumps is placed onto the contact pads of the substrate. The package is heated to reflow the solder bumps, gold and nickel-boron into solder joints that attach the integrated circuit to the substrate. The package is then typically shipped and mounted to a printed circuit board by soldering the pins to the board.

REFERENCES:
patent: 3977840 (1976-08-01), Estep et al.
patent: 4323914 (1982-04-01), Berndlmaier et al.
patent: 4970571 (1990-11-01), Yamakawa et al.
patent: 5066550 (1991-11-01), Horibe et al.
patent: 5089881 (1992-02-01), Panicker
patent: 5342806 (1994-08-01), Asahina
patent: 5436412 (1995-07-01), Ahmad et al.
patent: 5468995 (1995-11-01), Higgins, III
patent: 5583073 (1996-12-01), Lin et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

C4 substrate contact pad which has a layer of NI-B plating does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with C4 substrate contact pad which has a layer of NI-B plating, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and C4 substrate contact pad which has a layer of NI-B plating will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-222076

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.