4. Metal working
  5. Method of mechanical manufacture
  6. Electrical device making

Alfons Vindasius

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Conductive epoxy flip-chip on chip

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Method for forming conductive epoxy flip-chip on chip

Metal working – Method of mechanical manufacture – Electrical device making
Patent

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Method for forming vertical interconnect process for silicon seg

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Patent

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Method for forming vertical interconnect process for silicon seg

Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor
Patent

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Method for forming vertical interconnect process for silicon...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1263457

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