Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
Inventor
active
Integrated circuit protection and ruggedization coatings and...
Integrated circuit tampering protection and reverse...
Low modulus stress buffer coating in microelectronic devices
Stacked packaging designs offering inherent anti-tamper...
Tamper resistant packaging with transient liquid phase bonding
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Profile ID: LFUS-PAI-P-3208368