Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2007-04-10
2011-12-27
Roman, Angel (Department: 2812)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C427S126100, C427S376300, C257S678000
Reexamination Certificate
active
08084855
ABSTRACT:
A method of protecting an electronics package is discussed along with devices formed by the method. The method involves providing at least one electronic component that requires protecting from tampering and/or reverse engineering. Further, the method includes mixing into a liquid glass material at least one of high durability micro-particles or high-durability nano-particles, to form a coating material. Further still, the method includes depositing the coating material onto the electronic component and curing the coating material deposited.
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Boone Alan P.
Lower Nathan P.
Wilcoxon Ross K.
Barbieri Daniel M.
Rockwell Collins, Inc.
Roman Angel
Sene Pape
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