4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. With provision for cooling the housing or its contents

Alain Caron

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Concurrent electrical signal wiring optimization for an...

Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design
Reexamination Certificate

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Concurrent electrical signal wiring optimization for an...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Integrated circuit chip having a ringed wiring layer...

Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design
Reexamination Certificate

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Modular chip integration techniques

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2741936

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