Ball film for integrated circuit fabrication and testing

Details Ball film for integrated circuit fabrication and testing Ball film for integrated circuit fabrication and testing

2006-05-31

2008-11-18

Cao, Phat X (Department: 2814)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S614000, C257SE21508

Reexamination Certificate

active

07452799

ABSTRACT:
According to one embodiment of the invention, a method of fabricating ball grid array packages includes providing a substrate, providing a ball film that includes a plurality of metal balls movably contained within respective slots of a thin film, coupling the metal balls to the substrate, and removing the thin film from the metal balls.

REFERENCES:
patent: 5219117 (1993-06-01), Lin
patent: 5861323 (1999-01-01), Hayes
patent: 6025258 (2000-02-01), Ochiai et al.
patent: 6426564 (2002-07-01), Ball
patent: 2001/0041437 (2001-11-01), Cobbley et al.

Affiliated with

Also associated with

Rating

Ball film for integrated circuit fabrication and testing does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Ball film for integrated circuit fabrication and testing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ball film for integrated circuit fabrication and testing will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4048956