Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate
2006-09-06
2009-06-23
Coleman, W. David (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
C257S587000, C257S778000
Reexamination Certificate
active
07550852
ABSTRACT:
An integrated circuit chip which has a plurality of pads and non-reflowable contact members to be connected by reflow attachment to external parts. Each of these contact members has a height-to-diameter ratio and uniform diameter favorable for absorbing strain under thermo-mechanical stress. The members have a solderable surface on each end and a layer of reflowable material on each end. Each member is solder-attached at one end to a chip contact pad, while the other end of each member is operable for reflow attachment to external parts.
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Matsunami Akira
Tellkamp John P
Brady, III Wade J
Coleman W. David
Rodgers Colleen E
Telecky, Jr. Frederick J
Texas Instruments Incorporated
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