Ball film for integrated circuit fabrication and testing

Details Ball film for integrated circuit fabrication and testing Ball film for integrated circuit fabrication and testing

2006-07-18

2006-07-18

Cao, Phat X. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Ball or nail head type contact, lead, or bond

C257S738000

Reexamination Certificate

active

07078821

ABSTRACT:
According to one embodiment of the invention, a method of fabricating ball grid array packages includes providing a substrate, providing a ball film that includes a plurality of metal balls movably contained within respective slots of a thin film, coupling the metal balls to the substrate, and removing the thin film from the metal balls.

REFERENCES:
patent: 4871110 (1989-10-01), Fukasawa et al.
patent: 5497938 (1996-03-01), McMahon et al.
patent: 5643831 (1997-07-01), Ochiai et al.
patent: 5861323 (1999-01-01), Hayes
patent: 6426564 (2002-07-01), Ball
patent: 6551917 (2003-04-01), Cobbley et al.

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