4. Metal fusion bonding
  5. With means to juxtapose and bond plural workpieces
  6. Wire lead bonder

Akio Bando

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Apparatus for connecting external leads

Metal fusion bonding – With means to juxtapose and bond plural workpieces – With means to treat workpieces
Patent

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Bonding apparatus

Metal fusion bonding – With means to juxtapose and bond plural workpieces – Plural discrete workpieces
Patent

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Bump forming method

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent

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Ultrasonic bonding apparatus for bonding a semiconductor device

Metal fusion bonding – With means to juxtapose and bond plural workpieces – Wire lead bonder
Patent

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Profile ID: LFUS-PAI-P-349727

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