Bonding apparatus

Details Bonding apparatus Bonding apparatus

1992-05-19

1993-04-27

Heinrich, Samuel M.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Plural discrete workpieces

228 447, 228 51, 15 211, B23K 308

Patent

active

052054608

ABSTRACT:
A bonding apparatus for semiconductor devices, etc., including a bonding stage which places chips, etc. thereon, a bonding tool which press-bonds leads to the chips, etc., and a wire brush which is next to the bonding stage so as to clean the bonding tool. The wire brush is attached to the upper surface of a brush-rotating plate which is rotatable about its axis, and the brush-rotating plate is rotary-driven by a motor. A complete cleaning of all the side surfaces as well as the undersurface of the bonding tool is accomplished by bringing the bonding tool into contact with portions of the wire brush which are off the center of the rotating wire brush.

REFERENCES:
patent: 4321738 (1982-03-01), Makhijani
patent: 4832246 (1989-05-01), Ono et al.
patent: 4993096 (1991-02-01), D'Amato

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