Bump forming method

Details Bump forming method Bump forming method

1998-01-12

1999-09-14

Picardat, Kevin M.

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438612, 2281805, H01L 2144

Patent

active

059536241

ABSTRACT:
A method for forming a bump on, for instance, an electrode of a semiconductor device out of a wire comprising the steps of forming a ball at the end of the bonding wire, pressing the ball against the electrode, and separating the ball from the wire by cutting the wire by a pair of cutters that advance toward each other along the diameter of the wire. The cut surface of the ball or the bump can be flattened by the cutters that presses the cut surface.

REFERENCES:
patent: 5395037 (1995-03-01), Takahashi et al.
patent: 5559054 (1996-09-01), Adamjee
patent: 5633204 (1997-05-01), Tago et al.
patent: 5686353 (1997-11-01), Yagi et al.
patent: 5723364 (1998-03-01), Nakamura et al.
patent: 5740956 (1998-04-01), Seo et al.

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