Apparatus for connecting external leads

Metal fusion bonding – With means to juxtapose and bond plural workpieces – With means to treat workpieces

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Details

228 62, 228 13, B23K 2026, H01L 21603

Patent

active

048877581

ABSTRACT:
An apparatus for connecting or bonding leads of solid-state devices to lead frames, etc. in which a solid-state device punched out of a film carrier by a punch is first picked up and held by a suction-adhesion head. A raising and lowering arm is then driven longitudinally and laterally so that the suction-adhesion head with the solid-state device thereon is moved to a position over a first bonding station. Then, the raising and lowering arm is lowered via a vertical driving mechanism, and the solid-state device held by the suction-adhesion head is pressed against a specified lead frame. A first bonding tool is lowered and simultaneously bonds the leads on two opposite sides of the solid-state device to the lead frame. Then, the first bonding tool is raised, and the suction-adhesion head is raised and moves back to a position over the punch. The lead frame to which two sides of the solid-state device have been thus bonded is fed, and at a second bonding position, the leads on the other two opposite sides of the solid-state device are bonded to the lead frame by a second bonding tool.

REFERENCES:
patent: 3791018 (1974-02-01), Johnston et al.
patent: 4404741 (1983-09-01), Lebet et al.
patent: 4411149 (1983-10-01), Delorme

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