Ultrasonic bonding apparatus for bonding a semiconductor device

Metal fusion bonding – With means to juxtapose and bond plural workpieces – Wire lead bonder

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228904, B23K 2010

Patent

active

051563185

ABSTRACT:
In a method for bonding inner leads arranged along a square opening of a tab tape to a semiconductor device, the inner leads of a pair of inner lead rows that face each other are bonded first to the semiconductor device and then a bonding tool is rotated 90 degrees so that inner leads of another pair of inner lead rows are bonded. An ultrasonic bonding apparatus that uses such a method includes a rotary shaft that has the bonding tool at the bottom and is rotated 90 degrees (or any desired angle) via rollers that are mounted eccentrically on the rotary shaft. When the rollers are moved back and forth via a cylinder assembly, the rotary shaft that is eccentric with the rollers is rotated and rotated back 90 degrees, thus making it possible to perform the bonding of inner leads arranged along the square opening of a tab tape by restraining the horn only twice.

REFERENCES:
patent: 3997100 (1976-12-01), Hofmeister
patent: 4239144 (1980-12-01), Ellis et al.
patent: 4550871 (1985-11-01), Chan et al.
patent: 4792079 (1988-12-01), Bansemir
patent: 4817848 (1989-04-01), Gabaldon

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