Akihiro Yaguchi

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Electronic component, electronic component assembly and electron

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent

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Encapsulated semiconductor device package having holes for elect

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent

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Lead frame and semiconductor device

Patent

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Lead frame and semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reissue Patent

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Lead frame and semiconductor device

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Patent

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Profile ID: LFUS-PAI-P-211191

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