Lead frame and semiconductor device

Details Lead frame and semiconductor device Lead frame and semiconductor device

1997-03-31

1998-11-17

Picardat, Kevin

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438121, H01L 2144

Patent

active

058375678

ABSTRACT:
A lead frame for use with a plastic encapsulated semiconductor device includes a tab on which the semiconductor chip is mounted, chip pad supporting leads, inner leads to be electrically coupled with the semiconductor chip, outer leads formed in a monoblock structure together with the inner leads, and a frame for supporting the chip pad supporting leads and outer leads. In the lead frame, there is disposed a dam member only between the outer leads. Alternatively, dummy outer leads are formed between the frame and leads adjacent thereto so as to connect the dummy leads to the outer leads by the dam member. The frame is removed after the semiconductor device is assembled.

REFERENCES:
patent: 5258331 (1993-11-01), Masumoto et al.
patent: 5336564 (1994-08-01), Moldavsky
patent: 5352633 (1994-10-01), Abbott
patent: 5422313 (1995-06-01), West
patent: 5432127 (1995-07-01), Lamson et al.

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