Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Patent
1997-03-31
1998-11-17
Picardat, Kevin
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
438121, H01L 2144
Patent
active
058375678
ABSTRACT:
A lead frame for use with a plastic encapsulated semiconductor device includes a tab on which the semiconductor chip is mounted, chip pad supporting leads, inner leads to be electrically coupled with the semiconductor chip, outer leads formed in a monoblock structure together with the inner leads, and a frame for supporting the chip pad supporting leads and outer leads. In the lead frame, there is disposed a dam member only between the outer leads. Alternatively, dummy outer leads are formed between the frame and leads adjacent thereto so as to connect the dummy leads to the outer leads by the dam member. The frame is removed after the semiconductor device is assembled.
REFERENCES:
patent: 5258331 (1993-11-01), Masumoto et al.
patent: 5336564 (1994-08-01), Moldavsky
patent: 5352633 (1994-10-01), Abbott
patent: 5422313 (1995-06-01), West
patent: 5432127 (1995-07-01), Lamson et al.
Kitano Makoto
Kumazawa Tetsuo
Nagata Tatsuya
Nakamura Atsushi
Suzuki Hiromichi
Hitachi , Ltd.
Picardat Kevin
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