Active solid-state devices (e.g., transistors, solid-state diode
Non-single crystal, or recrystallized, semiconductor...
Non-single crystal, or recrystallized, material containing...
Examiner
active
No affiliations
Advanced leadframe having predefined bases for attaching...
BGA package with traces for plating pads under the chip
Circuit board and method for mounting chip component
COF package and tape substrate used in same
Composite barrier layer
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Profile ID: LFUS-PAI-P-2162544