Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – Mesa structure
Reexamination Certificate
2005-01-25
2010-02-23
Le, Thao X (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Physical configuration of semiconductor
Mesa structure
C257S019000, C257SE25006, C257SE25013
Reexamination Certificate
active
07667299
ABSTRACT:
A circuit board includes a substrate including electrode patterns formed thereon, first chip components mounted on the substrate and a second chip component mounted on a side of electrodes of the first chip components opposite from the substrate. The second chip component is bonded at one electrode to an electrode of the first chip component and is also bonded at the other electrode to an electrode of the first chip component. By stacking chip components in plural stages, it is possible to mount chip components with a high density on the substrate, thereby enabling reduction of the size of the circuit board.
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Chinese Office Action issued Mar. 27, 2009 in connection with CN 200580003094.7 corresponding to the present U.S. patent application.
Hirano Masato
Mori Masato
Nakanishi Kiyoshi
Odani Akihiko
Onishi Hiroaki
Arora Ajay K
Le Thao X
Panasonic Corporation
Wenderoth , Lind & Ponack, L.L.P.
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