Adolf E. Wirsing

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Metallization composite having nickle intermediate/interface

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent

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Method and apparatus for vapor deposition of material onto a sub

Coating processes – Coating by vapor – gas – or smoke – Metal coating
Patent

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Method for forming interconnects on thin wafers

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Method for forming interconnects on thin wafers

Semiconductor device manufacturing: process – Miscellaneous
Reexamination Certificate

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Method of forming dual height solder interconnections

Metal fusion bonding – Process – Plural joints
Patent

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Profile ID: LFUS-PAI-P-552788

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