Method for forming interconnects on thin wafers

Details Method for forming interconnects on thin wafers Method for forming interconnects on thin wafers

2007-10-30

2007-10-30

Malsawma, Lex (Department: 2823)

Semiconductor device manufacturing: process

Miscellaneous

C118S728000

Reexamination Certificate

active

11184695

ABSTRACT:
A method of forming a semiconductor interconnect including, in the order recited: (a) providing a semiconductor wafer; (b) forming bonding pads in a terminal wiring level on the frontside of the wafer; (c) reducing the thickness of the wafer; (d) forming solder bumps on the bonding pads; and (e) dicing the wafer into bumped semiconductor chips.

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BUR919980169 Document, Mendelson et al., Method for Mounting Wafer Frame at Backside Grinding (BSG) Tool, Mar. 1999, 3 pages.

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