Metal fusion bonding – Process – Plural joints
Patent
1992-04-16
1993-10-12
Ramsey, Kenneth J.
Metal fusion bonding
Process
Plural joints
427 96, 427265, H01L 21283
Patent
active
052518060
ABSTRACT:
The present invention relates generally to a new interconnection and a method for making the same, and more particularly, to an elongated solder interconnection and a method for making the same. On an electronic carrier, a pad is formed on which a solder mass is deposited and capped with a metal layer, thereby forming an elongated solder interconnection. A further elongated solder interconnection can now be formed by forming a second solder mass on the first solder mass that has been capped by a metal layer. Additional elongated solder interconnection can be formed by capping the preceding solder mass and/or the last solder mass with a metal capping layer. Alternatively, the encapsulating layer can be in the form of a sidewall spacer formed on the sidewalls of the solder mass.
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Matsui et al, "VLSI Chip Interconnection Technology Using Stacked Solder Bumps" pp. 573-578.
Agarwala Birendra N.
Ahsan Aziz M.
Bross Arthur
Chadurjian Mark F.
Koopman Nicholas G.
Blecker Ira David
International Business Machines - Corporation
Ramsey Kenneth J.
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