Metallization composite having nickle intermediate/interface

Details Metallization composite having nickle intermediate/interface Metallization composite having nickle intermediate/interface

1994-01-14

1995-10-10

Jackson, Jerome

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

257761, 257762, 257763, 257764, 257765, 257767, 257768, H01L 2348, H01L 2946, H01L 2954, H01L 2962

Patent

active

054573459

ABSTRACT:
A metallization composite comprises a refractory metal, nickel, and copper. The refractory metal is preferably titanium (Ti), but other suitable refractory metals such as zirconium and hafnium can also be utilized. An additional optional layer of gold can overlie the copper. The metallization composite is used to connect a solder contact to a semiconductor substrate.

REFERENCES:
patent: 3893160 (1975-07-01), Botzenhardt
patent: 3990094 (1976-11-01), Konantz et al.
patent: 4096510 (1978-06-01), Arai et al.
patent: 4176443 (1979-12-01), Iannuzzi et al.
patent: 4197551 (1980-04-01), Adlerstein
patent: 4316208 (1982-02-01), Kobayashi et al.
patent: 4319264 (1982-03-01), Gangulee et al.
patent: 4742023 (1988-05-01), Hasegawa
patent: 4840302 (1989-06-01), Gardner et al.
patent: 4954870 (1990-09-01), Takemura et al.
L. F. Miller, IBM Technical Disclosure Bulletin, vol. 16, No. 1, p. 39 (Jun. 1973).

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