Isolated electrostatic wafer blade clamp

Details Isolated electrostatic wafer blade clamp Isolated electrostatic wafer blade clamp

1989-04-10

1990-10-09

Pellinen, A. D.

Electricity: electrical systems and devices

Electric charge generating or conducting means

Use of forces of electric charge or field

118500, 29900, H02N 1300

Patent

active

049624415

ABSTRACT:
An electrostatic-clamping robotic-type semiconductor wafer-holding blade designed to optimize the electrostatic clamping force and decrease the required clamping voltage. The wafer blade includes: a base; interleaved electrodes formed on the base, alternating electrodes being connected in common electrically; and preferably a layer of dielectric material such as Al.sub.2 O.sub.3 having a thickness ranging between 2 mils and 15 mils disposed over the interleaved electrodes and the base to minimize the applied voltage necessary to flatten the wafer against the blade, without dielectric breakdown. The ratio of electrode width to the distance between electrodes ranges from 3/1 to 2/1 to optimize the electrostatic clamping force exerted by the blade.

REFERENCES:
patent: 4502094 (1985-02-01), Lewin et al.
patent: 4724510 (1988-02-01), Wicker et al.
patent: 4733632 (1988-03-01), Ohmi et al.

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