Methods of improving single layer resist patterning scheme

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Electron beam imaging

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C430S328000, C430S330000, C430S942000

Reexamination Certificate

active

07407736

ABSTRACT:
Methods for improving a single layer resist (SLR) patterning scheme, and in particular, its SLR layer and anti-reflective coating (ARC) etch selectivity, are disclosed. In one method, a patterned SLR layer over an anti-reflective coating (ARC) is provided and at least a portion of the patterned SLR layer and a portion of the ARC are exposed to radiation. The radiation may include, for example, an electron beam or an ion beam. The radiation exposure selectively breaks the polymer chains of the ARC and reduces the thickness of the ARC due to the loss of volatile function groups and free volume. As a result, the etch rate of the ARC is increased due to the conversion from polymer to monomer. Therefore, less resist will be consumed during, for example, an ARC open etch.

REFERENCES:
patent: 3745358 (1973-07-01), Firtz et al.
patent: 3874916 (1975-04-01), Livesay et al.
patent: 3887811 (1975-06-01), Livesay
patent: 3922546 (1975-11-01), Livesay
patent: 3983401 (1976-09-01), Livesay
patent: 4528452 (1985-07-01), Livesay
patent: 5003178 (1991-03-01), Livesay
patent: 6132814 (2000-10-01), Livesay et al.
patent: 6210856 (2001-04-01), Lin et al.
patent: 6319655 (2001-11-01), Wong et al.
patent: 6407399 (2002-06-01), Livesay
patent: 6489225 (2002-12-01), Ross et al.
patent: 6607991 (2003-08-01), Livesay et al.
patent: 6753129 (2004-06-01), Livesay et al.
patent: 6831284 (2004-12-01), Demos et al.
patent: 6890825 (2005-05-01), Ross et al.
patent: 6900001 (2005-05-01), Livesay et al.
patent: 6939664 (2005-09-01), Huang et al.
patent: 7361444 (2008-04-01), Angelopoulos et al.
patent: 2001/0016302 (2001-08-01), Hirayanagi et al.
patent: 2004/0152024 (2004-08-01), Livesay et al.
Chung-Hsi J. Wu, et al., “Investigation on the Mechanism of the 193nm Resist Linewidth Reduction During the SEM Measurement”, Proceedings of SPIE, vol. 4345 (2001).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Methods of improving single layer resist patterning scheme does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods of improving single layer resist patterning scheme, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods of improving single layer resist patterning scheme will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4012232

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.