Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
Reexamination Certificate
2005-08-29
2008-05-06
Lebentritt, Michael (Department: 2812)
Semiconductor device manufacturing: process
Chemical etching
Combined with coating step
C257SE23124
Reexamination Certificate
active
07368391
ABSTRACT:
A method for designing a carrier substrate includes configuring at least one die-attach location and one or more terminals that protrude from a surface of the carrier substrate so as to prevent adhesive material from contaminating connection surfaces thereof. The method may also include configuring the carrier substrate to include one or more recessed areas that laterally surround at least a portion of the die-attach location to receive excess adhesive.
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Lee Choon Kuan
Lee Kian Chai
Lim Guek Har
Poh Cheng Pour
Poh Teck Huat
Lebentritt Michael
Micro)n Technology, Inc.
Stevenson Andre′
TraskBritt
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