4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Solder wettable contact, lead, or bond

Guek Har Lim

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Methods for designing carrier substrates with raised terminals

Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
Reexamination Certificate

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Solder masks for use on carrier substrates, carrier...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Solder wettable contact – lead – or bond
Reexamination Certificate

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Solder masks for use on carrier substrates, carrier...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate

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Solder masks including dams for at least partially...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2700166

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