4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame
  6. On insulating carrier other than a printed circuit board

Kian Chai Lee

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Apparatus for flip-chip packaging providing testing capability

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate

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Apparatus for package reduction in stacked chip and board...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Apparatus for package reduction in stacked chip and board...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Balanced semiconductor device packages including lead frame...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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BOC BGA package for die with I-shaped bond pad layout

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2287192

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