Process for defect reduction in electrochemical plating

Details Process for defect reduction in electrochemical plating Process for defect reduction in electrochemical plating

2007-08-07

2007-08-07

Lee, Calvin (Department: 2818)

Semiconductor device manufacturing: process

Radiation or energy treatment modifying properties of...

Reexamination Certificate

active

09971210

ABSTRACT:
A pre-ECD surface treatment. After forming the barrier material (110) and seed layer (112), the surface of the seed layer (112) is treated with an H2plasma to remove surface contamination (122), reduce any CuOx(123), and improve wettability. The ECD copper film (124) is then formed over the seed layer (112).

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