High performance stress-enhanced MOSFETs using Si:C and SiGe...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S377000, C438S552000, C438S553000, C438S671000, C438S717000, C438S736000, C438S752000, C257S019000, C257S055000, C257S063000, C257S616000

Reexamination Certificate

active

10689506

ABSTRACT:
A semiconductor device and method of manufacturing a semiconductor device. The semiconductor device includes channels for a pFET and an nFET. A SiGe layer is selectively grown in the source and drain regions of the pFET channel and a Si:C layer is selectively grown in source and drain regions of the nFET channel. The SiGe and Si:C layer match a lattice network of the underlying Si layer to create a stress component. In one implementation, this causes a compressive component in the pFET channel and a tensile component in the nFET channel.

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