Polishing assembly with a window

Abrading – Precision device or process - or with condition responsive... – By optical sensor

Reexamination Certificate

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C451S041000, C451S287000

Reexamination Certificate

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11532498

ABSTRACT:
The polishing pad for a chemical mechanical polishing apparatus, and a method of making the same. The polishing pad has a covering layer with a polishing surface and a backing layer which is adjacent to the platen. A first opening in the covering layer with a first cross-sectional area and a second opening in the backing layer with a second, different cross-sectional area form an aperture through the polishing pad. A substantially transparent polyurethane plug is positioned in the aperture, and an adhesive material fixes the plug in the aperture.

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