Methods of forming a capacitor

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S239000, C438S785000

Reexamination Certificate

active

11112127

ABSTRACT:
A method of forming a capacitor having a capacitor dielectric layer comprising ABO3, where “A” is selected from the group consisting of Group IIA and Group IVB metal elements and mixtures thereof, where “B” is selected from the group consisting of Group IVA elements and mixtures thereof, includes feeding a plurality of precursors comprising A, B and O to a chamber having a substrate positioned therein under conditions effective to chemical vapor deposit an ABO3-comprising dielectric layer over the substrate. During the feeding, pressure within the chamber is varied effective to produce different concentrations of B at different elevations in the deposited layer and where higher comparative pressure produces greater concentration of B. The ABO3-comprising dielectric layer is incorporated into a capacitor, with the ABO3-comprising dielectric layer comprising a capacitor dielectric layer of the capacitor and having a dielectric constant k of at least 20 in the capacitor.

REFERENCES:
patent: 4105810 (1978-08-01), Yamazaki et al.
patent: 4261698 (1981-04-01), Carr et al.
patent: 4691662 (1987-09-01), Roppel et al.
patent: 5006363 (1991-04-01), Fujii et al.
patent: 5164363 (1992-11-01), Eguchi et al.
patent: 5183510 (1993-02-01), Kimura
patent: 5254505 (1993-10-01), Kamiyama
patent: 5256455 (1993-10-01), Numasawa
patent: 5261961 (1993-11-01), Takasu et al.
patent: 5270241 (1993-12-01), Dennison et al.
patent: 5312783 (1994-05-01), Takasaki et al.
patent: 5392189 (1995-02-01), Fazan et al.
patent: 5395771 (1995-03-01), Nakato
patent: 5459635 (1995-10-01), Tomozawa et al.
patent: 5468687 (1995-11-01), Carl et al.
patent: 5470398 (1995-11-01), Shibuya et al.
patent: 5525156 (1996-06-01), Manada et al.
patent: 5596214 (1997-01-01), Endo
patent: 5614018 (1997-03-01), Azuma et al.
patent: 5618761 (1997-04-01), Eguchi et al.
patent: 5635741 (1997-06-01), Tsu et al.
patent: 5656329 (1997-08-01), Hampden-Smith
patent: 5663089 (1997-09-01), Tomozawa et al.
patent: 5702562 (1997-12-01), Wakahara
patent: 5711816 (1998-01-01), Kirlin et al.
patent: 5719417 (1998-02-01), Roeder et al.
patent: 5723361 (1998-03-01), Azuma et al.
patent: 5731948 (1998-03-01), Yializis et al.
patent: 5736759 (1998-04-01), Haushaalter
patent: 5776254 (1998-07-01), Yuuki et al.
patent: 5783253 (1998-07-01), Roh
patent: 5798903 (1998-08-01), Dhote et al.
patent: 5834060 (1998-11-01), Kawahara et al.
patent: 5909043 (1999-06-01), Summerfelt
patent: 5972430 (1999-10-01), DiMeo, Jr. et al.
patent: 5976990 (1999-11-01), Mercaldi et al.
patent: 5989927 (1999-11-01), Yamonobe
patent: 6025222 (2000-02-01), Kimura et al.
patent: 6037205 (2000-03-01), Huh et al.
patent: 6043526 (2000-03-01), Ochiai
patent: 6046345 (2000-04-01), Kadokura et al.
patent: 6078492 (2000-06-01), Huang et al.
patent: 6090443 (2000-07-01), Eastep
patent: 6101085 (2000-08-01), Kawahara et al.
patent: 6126753 (2000-10-01), Shinriki et al.
patent: 6127218 (2000-10-01), Kang
patent: 6143597 (2000-11-01), Matsuda et al.
patent: 6143679 (2000-11-01), Nagasawa
patent: 6146907 (2000-11-01), Xiang et al.
patent: 6150684 (2000-11-01), Sone
patent: 6153898 (2000-11-01), Watanabe
patent: 6156638 (2000-12-01), Agarwal et al.
patent: 6165834 (2000-12-01), Agarwal et al.
patent: 6211096 (2001-04-01), Allman
patent: 6215650 (2001-04-01), Gnade et al.
patent: 6236076 (2001-05-01), Arita et al.
patent: 6238734 (2001-05-01), Senzaki et al.
patent: 6245652 (2001-06-01), Gardner et al.
patent: 6258170 (2001-07-01), Somekh
patent: 6258654 (2001-07-01), Gocho
patent: 6277436 (2001-08-01), Stauf et al.
patent: 6285051 (2001-09-01), Ueda et al.
patent: 6287935 (2001-09-01), Coursey
patent: 6323057 (2001-11-01), Sone
patent: 6325017 (2001-12-01), DeBoer et al.
patent: 6335049 (2002-01-01), Basceri
patent: 6335302 (2002-01-01), Satoh
patent: 6337496 (2002-01-01), Jung
patent: 6338970 (2002-01-01), Suh
patent: 6362068 (2002-03-01), Summerfelt
patent: 6372686 (2002-04-01), Golden
patent: 6422281 (2002-07-01), Ensign Jr. et al.
patent: 6500487 (2002-12-01), Holst et al.
patent: 6507060 (2003-01-01), Ren et al.
patent: 6525365 (2003-02-01), Basceri et al.
patent: 6527028 (2003-03-01), Miller
patent: 6558517 (2003-05-01), Basceri
patent: 6566147 (2003-05-01), Basceri et al.
patent: 6602376 (2003-08-01), Bradshaw
patent: 6727140 (2004-04-01), Basceri et al.
patent: 6838122 (2005-01-01), Basceri et al.
patent: 6838293 (2005-01-01), Basceri et al.
patent: 6878602 (2005-04-01), Basceri et al.
patent: 6884475 (2005-04-01), Basceri
patent: 6908639 (2005-06-01), Basceri et al.
patent: 6952029 (2005-10-01), Basceri
patent: 6962824 (2005-11-01), Basceri et al.
patent: 6982103 (2006-01-01), Basceri et al.
patent: 6995419 (2006-02-01), Agarwal et al.
patent: 7005695 (2006-02-01), Agarwal
patent: 7011978 (2006-03-01), Basceri
patent: 7023043 (2006-04-01), Basceri et al.
patent: 7029985 (2006-04-01), Basceri et al.
patent: 7073730 (2006-07-01), Haag et al.
patent: 2002/0197793 (2002-12-01), Dornfest et al.
patent: 2003/0017265 (2003-01-01), Basceri et al.
patent: 2003/0017266 (2003-01-01), Basceri et al.
patent: 2003/0045006 (2003-03-01), Basceri
patent: 0030798 (1981-06-01), None
patent: 0306069 (1989-03-01), None
patent: 0388957 (1990-09-01), None
patent: 0474140 (1992-03-01), None
patent: 0810666 (1997-12-01), None
patent: 0835950 (1998-04-01), None
patent: 0855735 (1998-07-01), None
patent: 0892426 (1999-01-01), None
patent: 0957522 (1999-11-01), None
patent: 2194555 (1988-03-01), None
patent: 2250970 (1990-10-01), None
patent: 0424922 (1992-01-01), None
patent: 04115533 (1992-04-01), None
patent: 04180566 (1992-06-01), None
patent: 08-060347 (1996-03-01), None
patent: 2000091333 (2000-03-01), None
patent: 98/39497 (1998-09-01), None
patent: 99/64645 (1999-12-01), None
patent: 01/16395 (2001-03-01), None
T. Aoyama et al.,Leakage current Mechanism of Amorphous and Polycrystalling Ta2O5Films Grown by Chemical Vapor Deposition, J. Electrochem. Soc., vol. 143, No. 3, pp. 977-983 (Mar. 1996).
T. T. Arai et al.,Preparation of SrTiO3Films on 8-inch Wafers by chemical Vapor Deposition, JPN, J. Appl. Phys., vol. 35, Pt. 1, No. 9B, pp. 4875-4879 (Sep. 1996).
C. Basceri, PH. D. Dissertation:Electrical and Dielectric Properties of (Ba,Sr)TiO3Thin Film Capacitors for. . . Dept. of Materials Science and Engineering, North Carolina University, Raleigh, NC, 171 pages (1997).
C. Basceri et al.,The dielectric response as a function of temperature and film thickness of fiber-textured (Ba,Sr)TiO3thin films grown by chemical. . . , J. Appl. Phys., 82 (5), pp. 2497-2504 (Sep. 1997).
S. Bilodeau et al.,Composition Dependence of the Dielectric Properties of MOCVD BaxSr1−xTiO3, Advanced Technology Materials, Presented at MRS Fall Meeting, pp. 1-21 (Dec. 1994).
S. M. Bilodeau et al.,MOCVD BST for High Density DRAM Applications, Published in proceedings of CVD Technologies for Inter-Level Dielectrics and Interconnects symposium at SEMICON/WEST, 2 pages (Jul. 1995).
Y-C Choi et al.,Improvements of the Properties of Chemical-Vapor-Deposited (Ba,Sr)TiO3Films Through Use of a Seed Layer, Jpn. J. Appl. Phys., vol. 36, No. 11, Pt. 1, pp. 6824-6828 (1997).
C.M. Chu et al.,Electrical properties and crystal structure of (Ba,SR)TiO3films prepared at low temperatures On a LaNiO3electrode by. . . , Appl. Phys. Lett., vol. 70, No. 2, pp. 249-51 (Jan. 1997).
K. Eguchi et al.,Chemical vapor deposition of (Ba,Sr)TiO3thin films for application in gigabit scale dynamic random access memories, Integrated Ferroelectrics, vol. 14, Nos. 1-4, Pt. 1, pp. 33-42 (1997).
Q. X. Jia et al,Structural and dielectric properties of Ba0.5Sr0.5TiO3thin films with an epi-RuO)2bottom electrode, Integrated Ferroelectrics, vol. 19, Nos. 1-4, pp. 111-119 (1998).
T. Kawahara et al.,(Ba,SR)liO3Films Prepared by Liquid Source Chemical Vapor Deposition on Ru Electrodes, Jpn. J. Appl. Phys., vol. 35, No. 9B, Pt. 1, pp. 4880-4883 (Sep. 1996).
R. Khamankar et al.,A Novel Low-Temperature Process for High Dielectric Constant BST Thin Films for ULSI DRAM. . . , Microelectronics Research Center, Univ. of Texas at Austin, TX , 2 pages

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Methods of forming a capacitor does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods of forming a capacitor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods of forming a capacitor will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3804182

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.