Capacitor of semiconductor device and method for forming the...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S244000, C438S253000, C438S387000, C438S702000, C438S703000, C438S723000

Reexamination Certificate

active

07074668

ABSTRACT:
In a method for forming a capacitor for use in a semiconductor device, a nitride film for stopping etching, a first mold oxide film, an insulating film, deposited on a substrate are etched to expose the respective storage node contacts and thereby to form a plurality of contact holes arrayed in a zigzag pattern for storage electrodes. A sacrificial oxide film is deposited by burying the contact holes for storage electrodes in a thickness such that an outer portion of the storage electrodes having a relatively short interval is completely buried while an outer portion the storage electrodes having a relatively long interval is not completely buried. The sacrificial oxide film and the insulation film are etched back to form a support network enclosing the respective storage electrodes and interconnected to each other.

REFERENCES:
patent: 5770098 (1998-06-01), Araki et al.
patent: 6929999 (2005-08-01), Park et al.
patent: 2001/0006834 (2001-07-01), Hirota et al.
patent: 2003/0235946 (2003-12-01), Lee et al.
patent: 2004/0217407 (2004-11-01), Cho et al.

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